部件型号 |
厂商 |
描述 |
|
NXP Semiconductors |
Data Conversion Systems SMART LABEL IC UCODE HSL |
|
NXP Semiconductors |
Data Conversion Systems Dedicated Chip For Smart Lapel APPS |
|
NXP Semiconductors |
Data Conversion Systems I.CODE SLI FCP REEL |
|
NXP Semiconductors |
Data Conversion Systems Dedicated Chip For Smart Lapel APPS |
|
NXP Semiconductors |
Data Conversion Systems Dedicated Chip For Smart Lapel APPS |
|
NXP Semiconductors |
Data Conversion Systems Addendum contactless chip card module |
|
NXP Semiconductors |
Data Conversion Systems SMART LABEL/TAG IC UCODE HSL |
|
NXP Semiconductors |
Data Conversion Systems I.CODE EPC FCP |
|
NXP Semiconductors |
Data Conversion Systems SMRT LABEL IC BUMPED WAFER SPECIFICATION |
|
NXP Semiconductors |
Data Conversion Systems I.CODE SLI FCP REEL HOT-LAM |
|
NXP Semiconductors |
Data Conversion Systems Bumped Wafer Wafer |
|
NXP Semiconductors |
Data Conversion Systems I.CODE 1 MOA2 MOD |
|
NXP Semiconductors |
Data Conversion Systems I.CODE EPC FCP |
|
NXP Semiconductors |
Data Conversion Systems SMART LABEL/TAG IC UCODE EPC GEN 2 |
|
NXP Semiconductors |
Data Conversion Systems UHF RFID Smart Label IC |
|
nxp semiconductors |
SL2ICS1201DW/UNCASED/FOIL//V1 |
|
nxp semiconductors |
SL2ICS5311EW/UNCASED/FOIL//V7 |
|
nxp semiconductors |
SL2ICS5001EW/UNCASED/FOIL//V7 |